BC807-16E6327
vs
BC807-16,215
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
SIEMENS A G
NXP SEMICONDUCTORS
Package Description
SMALL OUTLINE, R-PDSO-G3
PLASTIC PACKAGE-3
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.21.00.75
8541.21.00.95
Collector Current-Max (IC)
0.5 A
0.5 A
Collector-Emitter Voltage-Max
45 V
45 V
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
60
100
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
Number of Elements
1
1
Number of Terminals
3
3
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Polarity/Channel Type
PNP
PNP
Power Dissipation Ambient-Max
0.33 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
200 MHz
80 MHz
VCEsat-Max
0.7 V
0.7 V
Base Number Matches
3
2
Rohs Code
Part Package Code
TO-236
Pin Count
3
Manufacturer Package Code
SOT23
JEDEC-95 Code
TO-236AB
JESD-609 Code
e3
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Power Dissipation-Max (Abs)
0.35 W
Terminal Finish
TIN
Time@Peak Reflow Temperature-Max (s)
30
Transistor Application
SWITCHING
Compare BC807-16E6327 with alternatives
Compare BC807-16,215 with alternatives