BBY40 vs BBY40 feature comparison

BBY40 YAGEO Corporation

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BBY40 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS NXP SEMICONDUCTORS
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00
Breakdown Voltage-Min 28 V 30 V
Configuration SINGLE SINGLE
Diode Capacitance Ratio-Min 5 5
Diode Capacitance-Nom 5.15 pF 29 pF
Diode Element Material SILICON SILICON
Diode Type VARIABLE CAPACITANCE DIODE VARIABLE CAPACITANCE DIODE
Frequency Band VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY VERY HIGH FREQUENCY
JESD-30 Code R-PDSO-G3 R-PDSO-G3
Number of Elements 1 1
Number of Terminals 3 3
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Variable Capacitance Diode Classification ABRUPT ABRUPT
Base Number Matches 3 10
Pbfree Code Yes
Rohs Code Yes
Package Description PLASTIC, SMD, 3 PIN
Pin Count 3
Samacsys Manufacturer NXP
Diode Cap Tolerance 10.34%
JEDEC-95 Code TO-236AB
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Peak Reflow Temperature (Cel) 260
Rep Pk Reverse Voltage-Max 30 V
Reverse Current-Max 0.01 µA
Reverse Test Voltage 28 V
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

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