BB181,135
vs
BB143,115
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOD
|
|
Pin Count |
2
|
|
Manufacturer Package Code |
SOD523
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00
|
8541.10.00.80
|
Factory Lead Time |
13 Weeks
|
|
Samacsys Manufacturer |
NXP
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Capacitance Ratio-Min |
12
|
2.1
|
Diode Capacitance-Nom |
12.5 pF
|
5.3 pF
|
Diode Type |
VARIABLE CAPACITANCE DIODE
|
VARIABLE CAPACITANCE DIODE
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Rep Pk Reverse Voltage-Max |
30 V
|
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Tin (Sn)
|
TIN
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Variable Capacitance Diode Classification |
ABRUPT
|
ABRUPT
|
Base Number Matches |
1
|
1
|
Package Description |
|
R-PDSO-F2
|
Diode Element Material |
|
SILICON
|
JESD-30 Code |
|
R-PDSO-F2
|
Number of Terminals |
|
2
|
Operating Temperature-Max |
|
150 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Qualification Status |
|
Not Qualified
|
Terminal Form |
|
FLAT
|
Terminal Position |
|
DUAL
|
|
|
|
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