BAV23S-235
vs
BAV23ST/R
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NEXPERIA
NXP SEMICONDUCTORS
Package Description
PLASTIC PACKAGE-3
PLASTIC PACKAGE-3
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.70
8541.10.00.70
Date Of Intro
2017-02-17
Additional Feature
HALOGEN FREE
HALOGEN FREE
Application
GENERAL PURPOSE
GENERAL PURPOSE
Configuration
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JEDEC-95 Code
TO-236AB
TO-236AB
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
Number of Elements
2
2
Number of Terminals
3
3
Operating Temperature-Max
150 °C
150 °C
Output Current-Max
0.225 A
0.225 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Power Dissipation-Max
0.25 W
0.25 W
Rep Pk Reverse Voltage-Max
250 V
250 V
Reverse Recovery Time-Max
0.05 µs
0.05 µs
Surface Mount
YES
YES
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Rohs Code
Part Package Code
SOT-23
Pin Count
3
Forward Voltage-Max (VF)
1.25 V
JESD-609 Code
e3
Non-rep Pk Forward Current-Max
2.5 A
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Reverse Current-Max
0.1 µA
Terminal Finish
Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
40
Compare BAV23S-235 with alternatives
Compare BAV23ST/R with alternatives