BAV23S vs BAV23ST/R feature comparison

BAV23S Micro Commercial Components

Buy Now Datasheet

BAV23ST/R NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICRO COMMERCIAL COMPONENTS CORP NXP SEMICONDUCTORS
Package Description PLASTIC PACKAGE-3 PLASTIC PACKAGE-3
Pin Count 3 3
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.70 8541.10.00.70
Samacsys Manufacturer MCC
Configuration SERIES CONNECTED, CENTER TAP, 2 ELEMENTS SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 1.25 V 1.25 V
JESD-30 Code R-PDSO-G3 R-PDSO-G3
JESD-609 Code e0 e3
Non-rep Pk Forward Current-Max 3 A 2.5 A
Number of Elements 2 2
Number of Phases 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C
Output Current-Max 0.225 A 0.225 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Power Dissipation-Max 0.35 W 0.25 W
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 200 V 250 V
Reverse Current-Max 0.1 µA 0.1 µA
Reverse Recovery Time-Max 0.05 µs 0.05 µs
Surface Mount YES YES
Terminal Finish TIN LEAD Matte Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 5 1
Rohs Code Yes
Part Package Code SOT-23
Additional Feature HALOGEN FREE
Application GENERAL PURPOSE
JEDEC-95 Code TO-236AB
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

Compare BAV23S with alternatives

Compare BAV23ST/R with alternatives