BAV20
vs
BAV20,113
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Contact Manufacturer
|
Transferred
|
| Ihs Manufacturer |
HITANO ENTERPRISE CORP
|
NXP SEMICONDUCTORS
|
| Package Description |
PLASTIC PACKAGE-3
|
HERMETIC SEALED, GLASS, SC-40, 2 PIN
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.70
|
| Additional Feature |
LOW POWER LOSS
|
|
| Configuration |
COMMON CATHODE, 2 ELEMENTS
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
R-PDSO-G3
|
O-LALF-W2
|
| Number of Elements |
2
|
1
|
| Number of Terminals |
3
|
2
|
| Operating Temperature-Max |
125 °C
|
175 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Current-Max |
0.15 A
|
0.25 A
|
| Package Body Material |
PLASTIC/EPOXY
|
GLASS
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Power Dissipation-Max |
0.35 W
|
0.4 W
|
| Rep Pk Reverse Voltage-Max |
100 V
|
200 V
|
| Reverse Recovery Time-Max |
0.006 µs
|
0.05 µs
|
| Surface Mount |
YES
|
NO
|
| Terminal Form |
GULL WING
|
WIRE
|
| Terminal Position |
DUAL
|
AXIAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Base Number Matches |
35
|
2
|
| Part Package Code |
|
AXIAL
|
| Pin Count |
|
2
|
| Manufacturer Package Code |
|
SOD27
|
| Factory Lead Time |
|
4 Weeks
|
| Case Connection |
|
ISOLATED
|
| Forward Voltage-Max (VF) |
|
1.25 V
|
| JEDEC-95 Code |
|
DO-35
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Non-rep Pk Forward Current-Max |
|
5 A
|
| Number of Phases |
|
1
|
| Qualification Status |
|
Not Qualified
|
| Reference Standard |
|
CECC50001-022
|
| Reverse Current-Max |
|
0.1 µA
|
| Terminal Finish |
|
TIN
|
|
|
|
Compare BAV20 with alternatives
Compare BAV20,113 with alternatives