BAV199,215
vs
BAV199-T
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICRO COMMERCIAL COMPONENTS
|
Part Package Code |
TO-236
|
|
Package Description |
PLASTIC PACKAGE-3
|
|
Pin Count |
3
|
|
Manufacturer Package Code |
SOT23
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.70
|
|
Configuration |
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
|
Diode Element Material |
SILICON
|
|
Diode Type |
RECTIFIER DIODE
|
|
Forward Voltage-Max (VF) |
1.1 V
|
|
JEDEC-95 Code |
TO-236AB
|
|
JESD-30 Code |
R-PDSO-G3
|
|
JESD-609 Code |
e3
|
e0
|
Moisture Sensitivity Level |
1
|
1
|
Non-rep Pk Forward Current-Max |
4 A
|
|
Number of Elements |
2
|
|
Number of Terminals |
3
|
|
Operating Temperature-Max |
150 °C
|
|
Output Current-Max |
0.16 A
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
SMALL OUTLINE
|
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Power Dissipation-Max |
0.25 W
|
|
Qualification Status |
Not Qualified
|
|
Rep Pk Reverse Voltage-Max |
85 V
|
|
Reverse Recovery Time-Max |
3 µs
|
|
Surface Mount |
YES
|
|
Terminal Finish |
TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
2
|
4
|
|
|
|
Compare BAV199,215 with alternatives
-
BAV199,215 vs BAV199/T4
-
BAV199,215 vs BAV199E6327
-
BAV199,215 vs 934032640215
-
BAV199,215 vs BAV199T/R
-
BAV199,215 vs BAV199,235
-
BAV199,215 vs BAV199E6433
-
BAV199,215 vs BAV199LT1
-
BAV199,215 vs BAV199
-
BAV199,215 vs BAV199W-T
Compare BAV199-T with alternatives