BAT85136 vs BAT85-TP feature comparison

BAT85136 NXP Semiconductors

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BAT85-TP Micro Commercial Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MICRO COMMERCIAL COMPONENTS
Package Description O-LALF-W2 GLASS PACKAGE-2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.70 8541.10.00.70
Application GENERAL PURPOSE GENERAL PURPOSE
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 0.8 V 0.8 V
JEDEC-95 Code DO-34 DO-35
JESD-30 Code O-LALF-W2 O-LALF-W2
Non-rep Pk Forward Current-Max 5 A 0.6 A
Number of Elements 1 1
Number of Phases 1 1
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Output Current-Max 0.2 A 0.2 A
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Qualification Status Not Qualified Not Qualified
Reverse Current-Max 2 µA 2 µA
Reverse Recovery Time-Max 0.004 µs 0.005 µs
Surface Mount NO NO
Technology SCHOTTKY SCHOTTKY
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Base Number Matches 1 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code DO-35
Pin Count 2
Total Weight 128
Category CO2 Kg 8.8
CO2 1126.4
EU RoHS Version RoHS 2 (2015/863/EU)
EU RoHS Exemptions 7(c)-I
CAS Accounted for Wt 75
CA Prop 65 Presence YES
CA Prop 65 CAS Numbers 7440-02-0
Conflict Mineral Status DRC Conflict Free Undeterminable
Conflict Mineral Status Source Conflict Minerals Statement
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max 0.2 W
Rep Pk Reverse Voltage-Max 30 V
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 10

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