BAT54VV
vs
BAT54C,235
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Forward Voltage-Max (VF) |
0.24 V
|
1 V
|
| JESD-609 Code |
e0
|
e3
|
| Operating Temperature-Max |
125 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-55 °C
|
| Power Dissipation-Max |
0.17 W
|
0.25 W
|
| Rep Pk Reverse Voltage-Max |
30 V
|
30 V
|
| Reverse Current-Max |
2 µA
|
2 µA
|
| Reverse Test Voltage |
25 V
|
25 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
TO-236
|
| Package Description |
|
SOT-23, 3 PIN
|
| Pin Count |
|
3
|
| Manufacturer Package Code |
|
SOT23
|
| HTS Code |
|
8541.10.00.70
|
| Configuration |
|
COMMON CATHODE, 2 ELEMENTS
|
| Diode Element Material |
|
SILICON
|
| Diode Type |
|
RECTIFIER DIODE
|
| JEDEC-95 Code |
|
TO-236AB
|
| JESD-30 Code |
|
R-PDSO-G3
|
| Moisture Sensitivity Level |
|
1
|
| Non-rep Pk Forward Current-Max |
|
0.6 A
|
| Number of Elements |
|
2
|
| Number of Phases |
|
1
|
| Number of Terminals |
|
3
|
| Output Current-Max |
|
0.2 A
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Reference Standard |
|
AEC-Q101
|
| Reverse Recovery Time-Max |
|
0.005 µs
|
| Technology |
|
SCHOTTKY
|
| Terminal Form |
|
GULL WING
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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