BAT54HT1G Fairchild Semiconductor CorporationBuy Now Datasheet |
BAT54C,215 NXP SemiconductorsBuy Now Datasheet |
Pbfree Code | Yes | |
---|---|---|
Rohs Code | Yes | Yes |
Part Life Cycle Code | Transferred | Transferred |
Ihs Manufacturer | FAIRCHILD SEMICONDUCTOR CORP | NXP SEMICONDUCTORS |
Part Package Code | SOD-323 | TO-236 |
Package Description | SC-76, 2 PIN | SOT-23, 3 PIN |
Pin Count | 2 | 3 |
Manufacturer Package Code | 2LD, SOD323, JEITA SC76 (FORMED LEADS) | SOT23 |
Reach Compliance Code | compliant | compliant |
ECCN Code | EAR99 | EAR99 |
HTS Code | 8541.10.00.70 | 8541.10.00.70 |
Configuration | SINGLE | COMMON CATHODE, 2 ELEMENTS |
Diode Element Material | SILICON | SILICON |
Diode Type | RECTIFIER DIODE | RECTIFIER DIODE |
Forward Voltage-Max (VF) | 0.24 V | 1 V |
JESD-30 Code | R-PDSO-G2 | R-PDSO-G3 |
JESD-609 Code | e3 | e3 |
Moisture Sensitivity Level | 1 | 1 |
Non-rep Pk Forward Current-Max | 0.6 A | 0.6 A |
Number of Elements | 1 | 2 |
Number of Phases | 1 | 1 |
Number of Terminals | 2 | 3 |
Operating Temperature-Max | 150 °C | 150 °C |
Operating Temperature-Min | -55 °C | -55 °C |
Output Current-Max | 0.2 A | 0.2 A |
Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package Shape | RECTANGULAR | RECTANGULAR |
Package Style | SMALL OUTLINE | SMALL OUTLINE |
Peak Reflow Temperature (Cel) | 260 | 260 |
Power Dissipation-Max | 0.2 W | 0.25 W |
Qualification Status | Not Qualified | Not Qualified |
Rep Pk Reverse Voltage-Max | 30 V | 30 V |
Reverse Recovery Time-Max | 0.005 µs | 0.005 µs |
Surface Mount | YES | YES |
Terminal Finish | MATTE TIN | Tin (Sn) |
Terminal Form | GULL WING | GULL WING |
Terminal Position | DUAL | DUAL |
Time@Peak Reflow Temperature-Max (s) | 30 | 30 |
Base Number Matches | 1 | 1 |
JEDEC-95 Code | TO-236AB | |
Reference Standard | AEC-Q101 | |
Reverse Current-Max | 2 µA | |
Reverse Test Voltage | 25 V | |
Technology | SCHOTTKY | |