BAT54CFILM
vs
BAT54CXV3T1G
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
ONSEMI
|
| Package Description |
ROHS COMPLIANT, PLASTIC PACKAGE-3
|
HALOGEN FREE AND ROHS COMPLIANT, MINIATURE, CASE 463C-03, SC-89, 3 PIN
|
| Pin Count |
3
|
3
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.70
|
| Factory Lead Time |
16 Weeks
|
33 Weeks
|
| Samacsys Manufacturer |
STMicroelectronics
|
onsemi
|
| Configuration |
COMMON CATHODE, 2 ELEMENTS
|
COMMON CATHODE, 2 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.9 V
|
0.24 V
|
| JESD-30 Code |
R-PDSO-G3
|
R-PDSO-F3
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Pk Forward Current-Max |
1 A
|
0.6 A
|
| Number of Elements |
2
|
2
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
150 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Current-Max |
0.3 A
|
0.2 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
235
|
260
|
| Power Dissipation-Max |
0.25 W
|
0.24 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
40 V
|
30 V
|
| Reverse Recovery Time-Max |
0.005 µs
|
0.005 µs
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SC-89, 3 LEAD
|
| Manufacturer Package Code |
|
463C-02
|
| Number of Phases |
|
1
|
|
|
|
Compare BAT54CFILM with alternatives
Compare BAT54CXV3T1G with alternatives