BAS86-M-18
vs
JANS1N6641
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
VISHAY SEMICONDUCTORS
|
M/A-COM TECHNOLOGY SOLUTIONS INC
|
Part Package Code |
MELF
|
|
Package Description |
O-LELF-R2
|
SIMILAR TO DO-35, 2 PIN
|
Pin Count |
2
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.70
|
8541.10.00.70
|
Samacsys Manufacturer |
Vishay
|
|
Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
0.3 V
|
|
JESD-30 Code |
O-LELF-R2
|
O-XALF-W2
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
|
Output Current-Max |
0.2 A
|
0.3 A
|
Package Body Material |
GLASS
|
UNSPECIFIED
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Power Dissipation-Max |
0.2 W
|
|
Qualification Status |
Not Qualified
|
Qualified
|
Rep Pk Reverse Voltage-Max |
50 V
|
|
Reverse Recovery Time-Max |
0.005 µs
|
0.005 µs
|
Surface Mount |
YES
|
NO
|
Technology |
SCHOTTKY
|
|
Terminal Form |
WRAP AROUND
|
WIRE
|
Terminal Position |
END
|
AXIAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
2
|
10
|
Additional Feature |
|
METALLURGICALLY BONDED
|
Reference Standard |
|
MIL-19500/609D
|
|
|
|
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