BAS86,115
vs
BAS86
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
MELF
|
|
Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
HERMETIC SEALED, GLASS PACKAGE-2
|
Pin Count |
2
|
2
|
Manufacturer Package Code |
SOD80C
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.70
|
8541.10.00.70
|
Additional Feature |
ULTRA HIGH SPEED SWITCH
|
ULTRA HIGH SPEED SWITCH
|
Application |
GENERAL PURPOSE
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
0.9 V
|
0.9 V
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Non-rep Pk Forward Current-Max |
0.5 A
|
0.5 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Output Current-Max |
0.2 A
|
0.2 A
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Power Dissipation-Max |
0.3 W
|
0.3 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
250 V
|
50 V
|
Reverse Current-Max |
5 µA
|
5 µA
|
Reverse Recovery Time-Max |
0.004 µs
|
0.004 µs
|
Surface Mount |
YES
|
YES
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Terminal Finish |
TIN
|
Tin (Sn)
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
1
|
6
|
Pbfree Code |
|
Yes
|
Samacsys Manufacturer |
|
NXP
|
|
|
|
Compare BAS86,115 with alternatives
Compare BAS86 with alternatives