BAS83,115
vs
SD101AWS-TP-HF
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICRO COMMERCIAL COMPONENTS CORP
|
Package Description |
HERMETIC SEALED, GLASS, SMD, 2 PIN
|
|
Pin Count |
2
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.70
|
8541.10.00.70
|
Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1 V
|
1 V
|
JESD-30 Code |
O-LELF-R2
|
R-PDSO-G2
|
Non-rep Pk Forward Current-Max |
0.5 A
|
2 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
125 °C
|
Output Current-Max |
0.03 A
|
0.015 A
|
Package Body Material |
GLASS
|
PLASTIC/EPOXY
|
Package Shape |
ROUND
|
RECTANGULAR
|
Package Style |
LONG FORM
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Qualification Status |
Not Qualified
|
|
Reverse Current-Max |
0.2 µA
|
0.2 µA
|
Surface Mount |
YES
|
YES
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Terminal Form |
WRAP AROUND
|
GULL WING
|
Terminal Position |
END
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
10
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Operating Temperature-Min |
|
-55 °C
|
Power Dissipation-Max |
|
0.4 W
|
Rep Pk Reverse Voltage-Max |
|
60 V
|
Reverse Recovery Time-Max |
|
0.001 µs
|
Reverse Test Voltage |
|
50 V
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
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