BAS70-H
vs
BAS70,215
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
FORMOSA MICROSEMI CO LTD
NXP SEMICONDUCTORS
Package Description
R-PDSO-G3
PLASTIC PACKAGE-3
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.70
8541.10.00.70
Application
GENERAL PURPOSE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
3
3
Operating Temperature-Max
125 °C
150 °C
Operating Temperature-Min
-55 °C
Output Current-Max
0.07 A
0.07 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Rep Pk Reverse Voltage-Max
70 V
70 V
Reverse Recovery Time-Max
0.005 µs
Surface Mount
YES
YES
Technology
SCHOTTKY
SCHOTTKY
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Base Number Matches
1
2
Rohs Code
Part Package Code
TO-236
Pin Count
3
Manufacturer Package Code
SOT23
Forward Voltage-Max (VF)
0.41 V
JEDEC-95 Code
TO-236AB
JESD-609 Code
e3
Moisture Sensitivity Level
1
Non-rep Pk Forward Current-Max
0.1 A
Qualification Status
Not Qualified
Terminal Finish
TIN
Compare BAS70-H with alternatives
Compare BAS70,215 with alternatives