BAS40-05/G,215
vs
BAS40-05T-7-F
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
DIODES INC
|
Part Package Code |
TO-236
|
|
Pin Count |
3
|
3
|
Manufacturer Package Code |
SOT23
|
|
Reach Compliance Code |
unknown
|
compliant
|
Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
0.38 V
|
0.38 V
|
Non-rep Pk Forward Current-Max |
0.2 A
|
0.6 A
|
Operating Temperature-Max |
150 °C
|
125 °C
|
Output Current-Max |
0.12 A
|
0.2 A
|
Rep Pk Reverse Voltage-Max |
40 V
|
40 V
|
Surface Mount |
YES
|
YES
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Package Description |
|
GREEN, ULTRA SMALL, PLASTIC PACKAGE-3
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.70
|
Factory Lead Time |
|
8 Weeks
|
Samacsys Manufacturer |
|
Diodes Incorporated
|
Additional Feature |
|
FAST SWITCHING
|
Configuration |
|
COMMON CATHODE, 2 ELEMENTS
|
Diode Element Material |
|
SILICON
|
JESD-30 Code |
|
R-PDSO-G3
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Number of Elements |
|
2
|
Number of Terminals |
|
3
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
|
260
|
Power Dissipation-Max |
|
0.15 W
|
Qualification Status |
|
Not Qualified
|
Reverse Recovery Time-Max |
|
0.005 µs
|
Terminal Finish |
|
MATTE TIN
|
Terminal Form |
|
GULL WING
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare BAS40-05/G,215 with alternatives
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BAS40-05/G,215 vs BAS40-05
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BAS40-05/G,215 vs BAS40-05-T
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BAS40-05/G,215 vs BAS40-05,235
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BAS40-05/G,215 vs BAS40-05212
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BAS40-05/G,215 vs BAS40-05T
-
BAS40-05/G,215 vs BAS40-05-TP
-
BAS40-05/G,215 vs BAS40-05T-13
-
BAS40-05/G,215 vs BAS40-05/G
-
BAS40-05/G,215 vs BAS40-05T-H
Compare BAS40-05T-7-F with alternatives