BAS316,115
vs
BAS316RR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
TAIWAN SEMICONDUCTOR CO LTD
Part Package Code
SOD
Pin Count
2
Manufacturer Package Code
SOD323
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.70
8541.10.00.70
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
1.25 V
JESD-30 Code
R-PDSO-G2
R-PDSO-G2
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Non-rep Pk Forward Current-Max
4 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Output Current-Max
0.25 A
0.25 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Power Dissipation-Max
0.4 W
0.2 W
Qualification Status
Not Qualified
Not Qualified
Rep Pk Reverse Voltage-Max
85 V
Reverse Current-Max
1 µA
Reverse Recovery Time-Max
0.004 µs
0.004 µs
Surface Mount
YES
YES
Terminal Finish
TIN
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Base Number Matches
2
1
Package Description
ROHS COMPLIANT, PLASTIC PACKAGE-2
Application
GENERAL PURPOSE
Operating Temperature-Min
-65 °C
Compare BAS316,115 with alternatives
Compare BAS316RR with alternatives