BAS21X-TP
vs
BAV21WG
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
TAK CHEONG ELECTRONICS HOLDINGS CO LTD
|
Package Description |
R-PDSO-F2
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.70
|
8541.10.00.70
|
Samacsys Manufacturer |
MCC
|
|
Application |
GENERAL PURPOSE
|
HIGH VOLTAGE FAST RECOVERY
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.25 V
|
1.25 V
|
JESD-30 Code |
R-PDSO-F2
|
R-PDSO-G2
|
JESD-609 Code |
e3
|
e3
|
Non-rep Pk Forward Current-Max |
9 A
|
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-65 °C
|
|
Output Current-Max |
0.2 A
|
0.2 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Power Dissipation-Max |
0.15 W
|
0.4 W
|
Rep Pk Reverse Voltage-Max |
250 V
|
250 V
|
Reverse Current-Max |
0.1 µA
|
0.1 µA
|
Reverse Recovery Time-Max |
0.05 µs
|
0.05 µs
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
Terminal Form |
FLAT
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
1
|
1
|
Breakdown Voltage-Min |
|
250 V
|
Reverse Test Voltage |
|
200 V
|
|
|
|
Compare BAS21X-TP with alternatives
Compare BAV21WG with alternatives