BAS16L
vs
BAS16/LF1215
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
DFN
Package Description
1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC PACKAGE-2
SOT-23, 3 PIN
Pin Count
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.70
Application
GENERAL PURPOSE
GENERAL PURPOSE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
0.715 V
1.25 V
JESD-30 Code
R-PBCC-N2
R-PDSO-G3
JESD-609 Code
e3
Moisture Sensitivity Level
1
Non-rep Pk Forward Current-Max
4 A
0.5 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
3
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-65 °C
Output Current-Max
0.215 A
0.215 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Power Dissipation-Max
0.25 W
0.25 W
Qualification Status
Not Qualified
Rep Pk Reverse Voltage-Max
100 V
100 V
Reverse Recovery Time-Max
0.004 µs
0.004 µs
Surface Mount
YES
YES
Terminal Finish
Tin (Sn)
Terminal Form
NO LEAD
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
5
1
Additional Feature
LOW LEAKAGE CURRENT
JEDEC-95 Code
TO-236AB
Reference Standard
AEC-Q101; IEC-60134
Reverse Current-Max
50 µA
Reverse Test Voltage
80 V
Compare BAS16L with alternatives
Compare BAS16/LF1215 with alternatives