BAR63-02V
vs
BAP51-02T/R
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SC-79
|
SC-79
|
| Package Description |
R-PDSO-F2
|
R-PDSO-F2
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Samacsys Manufacturer |
Infineon
|
|
| Application |
SWITCHING
|
|
| Breakdown Voltage-Min |
50 V
|
60 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Capacitance-Max |
0.3 pF
|
0.55 pF
|
| Diode Capacitance-Nom |
0.21 pF
|
0.4 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Forward Resistance-Max |
2 Ω
|
2.5 Ω
|
| Diode Type |
PIN DIODE
|
PIN DIODE
|
| Frequency Band |
S BAND
|
|
| JESD-30 Code |
R-PDSO-F2
|
R-PDSO-F2
|
| JESD-609 Code |
e3
|
e3
|
| Minority Carrier Lifetime-Nom |
0.075 µs
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Power Dissipation-Max |
0.25 W
|
0.715 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reverse Test Voltage |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
| Terminal Finish |
Tin (Sn)
|
TIN
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
6
|
1
|
| Diode Res Test Current |
|
0.5 mA
|
| Diode Res Test Frequency |
|
100 MHz
|
| Operating Temperature-Min |
|
-65 °C
|
|
|
|
Compare BAR63-02V with alternatives
Compare BAP51-02T/R with alternatives