BAP50-05W,115
vs
934055505215
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SC-70
Package Description
PLASTIC, SC-70, 3 PIN
PLASTIC, SMD, SST3, 3 PIN
Pin Count
3
3
Manufacturer Package Code
SOT323
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00
8541.10.00.80
Samacsys Manufacturer
NXP
Breakdown Voltage-Min
50 V
50 V
Configuration
COMMON CATHODE, 2 ELEMENTS
COMMON CATHODE, 2 ELEMENTS
Diode Capacitance-Max
0.6 pF
0.6 pF
Diode Capacitance-Nom
0.45 pF
Diode Element Material
SILICON
SILICON
Diode Forward Resistance-Max
5 Ω
5 Ω
Diode Res Test Current
0.5 mA
Diode Res Test Frequency
100 MHz
Diode Type
PIN DIODE
PIN DIODE
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
JESD-609 Code
e3
e3
Minority Carrier Lifetime-Nom
1.05 µs
Moisture Sensitivity Level
1
1
Number of Elements
2
2
Number of Terminals
3
3
Operating Temperature-Max
150 °C
Operating Temperature-Min
-65 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Power Dissipation-Max
0.24 W
0.25 W
Qualification Status
Not Qualified
Not Qualified
Reverse Test Voltage
Surface Mount
YES
YES
Technology
POSITIVE-INTRINSIC-NEGATIVE
POSITIVE-INTRINSIC-NEGATIVE
Terminal Finish
Tin (Sn)
TIN
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
1
1
Compare BAP50-05W,115 with alternatives
Compare 934055505215 with alternatives