BAL74
vs
BAL74
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
DIODES INC
NXP SEMICONDUCTORS
Part Package Code
SOT-23
SOT-23
Package Description
SOT-23, 3 PIN
PLASTIC PACKAGE-3
Pin Count
3
3
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.70
8541.10.00.70
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
Number of Elements
1
1
Number of Terminals
3
3
Output Current-Max
0.15 A
0.215 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Power Dissipation-Max
0.33 W
0.25 W
Qualification Status
Not Qualified
Not Qualified
Reverse Recovery Time-Max
0.004 µs
0.004 µs
Surface Mount
YES
YES
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Base Number Matches
3
12
Pbfree Code
Rohs Code
Samacsys Manufacturer
NXP
Forward Voltage-Max (VF)
1.25 V
JEDEC-95 Code
TO-236AB
JESD-609 Code
e3
Moisture Sensitivity Level
1
Non-rep Pk Forward Current-Max
4 A
Number of Phases
1
Operating Temperature-Max
150 °C
Peak Reflow Temperature (Cel)
260
Rep Pk Reverse Voltage-Max
50 V
Reverse Current-Max
0.1 µA
Terminal Finish
Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
30
Compare BAL74 with alternatives
Compare BAL74 with alternatives