BAL74 vs BAL74,215 feature comparison

BAL74 Diodes Incorporated

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BAL74,215 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer DIODES INC NXP SEMICONDUCTORS
Part Package Code SOT-23 TO-236
Package Description SOT-23, 3 PIN PLASTIC PACKAGE-3
Pin Count 3 3
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.70 8541.10.00.70
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
JESD-30 Code R-PDSO-G3 R-PDSO-G3
Number of Elements 1 1
Number of Terminals 3 3
Output Current-Max 0.15 A 0.215 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Power Dissipation-Max 0.33 W 0.25 W
Qualification Status Not Qualified Not Qualified
Reverse Recovery Time-Max 0.004 µs 0.004 µs
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 3 1
Rohs Code Yes
Manufacturer Package Code SOT23
Forward Voltage-Max (VF) 1.25 V
JEDEC-95 Code TO-236AB
JESD-609 Code e3
Moisture Sensitivity Level 1
Non-rep Pk Forward Current-Max 4 A
Number of Phases 1
Operating Temperature-Max 150 °C
Peak Reflow Temperature (Cel) 260
Rep Pk Reverse Voltage-Max 50 V
Reverse Current-Max 0.1 µA
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

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