BAL74
vs
BAL74,215
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
DIODES INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOT-23
|
TO-236
|
Package Description |
SOT-23, 3 PIN
|
PLASTIC PACKAGE-3
|
Pin Count |
3
|
3
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.70
|
8541.10.00.70
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Output Current-Max |
0.15 A
|
0.215 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Power Dissipation-Max |
0.33 W
|
0.25 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reverse Recovery Time-Max |
0.004 µs
|
0.004 µs
|
Surface Mount |
YES
|
YES
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
3
|
1
|
Rohs Code |
|
Yes
|
Manufacturer Package Code |
|
SOT23
|
Forward Voltage-Max (VF) |
|
1.25 V
|
JEDEC-95 Code |
|
TO-236AB
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Non-rep Pk Forward Current-Max |
|
4 A
|
Number of Phases |
|
1
|
Operating Temperature-Max |
|
150 °C
|
Peak Reflow Temperature (Cel) |
|
260
|
Rep Pk Reverse Voltage-Max |
|
50 V
|
Reverse Current-Max |
|
0.1 µA
|
Terminal Finish |
|
TIN
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare BAL74 with alternatives
Compare BAL74,215 with alternatives