BA7760
vs
TAS5352DDV
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
ROHM CO LTD
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
DIP
|
TSSOP
|
| Package Description |
DIP, DIP14,.3
|
HTSSOP-44
|
| Pin Count |
14
|
44
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
ROHM Semiconductor
|
Texas Instruments
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| Gain |
0.7 dB
|
|
| Harmonic Distortion |
0.008%
|
|
| JESD-30 Code |
R-PDIP-T14
|
R-PDSO-G44
|
| JESD-609 Code |
e3/e2
|
e4
|
| Length |
19.4 mm
|
14 mm
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
44
|
| Operating Temperature-Max |
75 °C
|
70 °C
|
| Operating Temperature-Min |
-25 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
HTSSOP
|
| Package Equivalence Code |
DIP14,.3
|
TSSOP44,.33
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.55 mm
|
1.2 mm
|
| Supply Current-Max |
6.09 mA
|
17 mA
|
| Supply Voltage-Max (Vsup) |
14 V
|
13.2 V
|
| Supply Voltage-Min (Vsup) |
6 V
|
10.8 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL
|
| Terminal Finish |
TIN/TIN COPPER
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
30
|
| Width |
7.62 mm
|
6.1 mm
|
| Base Number Matches |
10
|
4
|
| Moisture Sensitivity Level |
|
3
|
| Output Power-Nom |
|
195 W
|
|
|
|
Compare BA7760 with alternatives
Compare TAS5352DDV with alternatives