BA5973FP
vs
BA5973FP-E2
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ROHM CO LTD
|
ROHM CO LTD
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
HSOP-28
|
HSOP-28
|
Pin Count |
28
|
28
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
CONSUMER CIRCUIT
|
CONSUMER CIRCUIT
|
JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G28
|
JESD-609 Code |
e3/e2
|
e3/e2
|
Length |
18.5 mm
|
18.5 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-35 °C
|
-35 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HSSOP
|
HSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.3 mm
|
2.3 mm
|
Supply Current-Max |
83.5 mA
|
83.5 mA
|
Supply Voltage-Max (Vsup) |
13.5 V
|
13.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN/TIN COPPER
|
TIN/TIN COPPER
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
10
|
10
|
Width |
7.5 mm
|
7.5 mm
|
Base Number Matches |
2
|
1
|
|
|
|