BA597
vs
BAP65-05WT/R
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOD
|
SC-70
|
| Package Description |
SOD-323, 2 PIN
|
R-PDSO-G3
|
| Pin Count |
2
|
3
|
| Manufacturer Package Code |
SOD-323
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
LOW DISTORTION
|
|
| Application |
ATTENUATOR; SWITCHING
|
ATTENUATOR; SWITCHING
|
| Breakdown Voltage-Min |
50 V
|
30 V
|
| Configuration |
SINGLE
|
COMMON CATHODE, 2 ELEMENTS
|
| Diode Capacitance-Nom |
0.52 pF
|
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Forward Resistance-Max |
4.2 Ω
|
0.9 Ω
|
| Diode Res Test Current |
10 mA
|
|
| Diode Type |
PIN DIODE
|
PIN DIODE
|
| Frequency Band |
HIGH FREQUENCY
|
|
| JESD-30 Code |
R-PDSO-G2
|
R-PDSO-G3
|
| JESD-609 Code |
e0
|
e3
|
| Minority Carrier Lifetime-Nom |
2.5 µs
|
0.17 µs
|
| Number of Elements |
1
|
2
|
| Number of Terminals |
2
|
3
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Power Dissipation-Max |
0.25 W
|
0.24 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reverse Test Voltage |
10 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
| Terminal Finish |
TIN LEAD
|
Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
1
|
| Diode Capacitance-Max |
|
0.9 pF
|
| Operating Temperature-Max |
|
150 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare BA597 with alternatives
Compare BAP65-05WT/R with alternatives