B82464P4684M000
vs
B82464G4684M000
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TDK CORP
|
EPCOS AG
|
Package Description |
CHIP
|
4141
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8504.50.80.00
|
8504.50.80.00
|
Samacsys Manufacturer |
TDK
|
TDK
|
Case/Size Code |
4141
|
4141
|
Construction |
Shielded
|
Rectangular
|
Core Material |
FERRITE
|
Ferrite
|
DC Resistance |
1.3 Ω
|
1.3 Ω
|
Inductance-Nom (L) |
680 µH
|
680 µH
|
Inductor Application |
POWER INDUCTOR
|
POWER INDUCTOR
|
Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
JESD-609 Code |
e3
|
e3
|
Number of Functions |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Height |
4.8 mm
|
4.8 mm
|
Package Length |
10.4 mm
|
10.4 mm
|
Package Style |
SMT
|
SMT
|
Package Width |
10.4 mm
|
10.4 mm
|
Packing Method |
TR, Blister, 13 Inch
|
TR, Blister, 13 Inch
|
Rated Current-Max |
0.42 A
|
0.42 A
|
Reference Standard |
AEC-Q200
|
AEC-Q200
|
Shape/Size Description |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
Shielded |
YES
|
YES
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN OVER NICKEL
|
TIN
|
Terminal Placement |
DUAL ENDED
|
DUAL ENDED
|
Terminal Shape |
WRAPAROUND
|
ONE SURFACE
|
Test Frequency |
0.1 MHz
|
0.1 MHz
|
Tolerance |
20%
|
20%
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
|
|
|