B82422T3220J000
vs
B82422T3220J008
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TDK CORP
|
TDK CORP
|
| Package Description |
CHIP
|
CHIP
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8504.50.80.00
|
8504.50.80.00
|
| Samacsys Manufacturer |
TDK
|
TDK
|
| Case/Size Code |
1210
|
1210
|
| Construction |
Rectangular
|
Rectangular
|
| Core Material |
Ceramic
|
Ceramic
|
| DC Resistance |
0.16 Ω
|
0.16 Ω
|
| Inductance-Nom (L) |
0.022 µH
|
0.022 µH
|
| Inductor Application |
RF INDUCTOR
|
RF INDUCTOR
|
| Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
| JESD-609 Code |
e4
|
e1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
2 mm
|
2 mm
|
| Package Length |
3.2 mm
|
3.2 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
2.5 mm
|
2.5 mm
|
| Packing Method |
TR, Blister, 7 Inch
|
TR, Blister, 13 Inch
|
| Quality Factor-Min (at L-nom) |
23
|
23
|
| Rated Current-Max |
0.45 A
|
0.45 A
|
| Reference Standard |
AEC-Q200
|
AEC-Q200
|
| Self Resonance Frequency |
2000 MHz
|
2000 MHz
|
| Shape/Size Description |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Shielded |
NO
|
NO
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
SILVER
|
TIN SILVER COPPER
|
| Terminal Placement |
DUAL ENDED
|
DUAL ENDED
|
| Terminal Shape |
J BEND
|
J BEND
|
| Test Frequency |
100 MHz
|
100 MHz
|
| Tolerance |
5%
|
5%
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare B82422T3220J000 with alternatives
Compare B82422T3220J008 with alternatives