B82422A3829K108 vs B82422A3829K150 feature comparison

B82422A3829K108 TDK Corporation

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B82422A3829K150 TDK Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TDK CORP TDK CORP
Package Description CHIP CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8504.50.80.00 8504.50.80.00
Case/Size Code 1210 1210
Construction Rectangular Rectangular
Core Material Ceramic Ceramic
DC Resistance 0.08 Ω 0.08 Ω
Inductance-Nom (L) 0.0082 µH 0.0082 µH
Inductor Application RF INDUCTOR RF INDUCTOR
Inductor Type GENERAL PURPOSE INDUCTOR GENERAL PURPOSE INDUCTOR
JESD-609 Code e1
Number of Functions 1 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 2 mm 2 mm
Package Length 3.2 mm 3.2 mm
Package Style SMT SMT
Package Width 2.5 mm 2.5 mm
Packing Method TR, Blister, 13 Inch TR, Blister, 7 Inch
Quality Factor-Min (at L-nom) 20 20
Rated Current-Max 0.8 A 0.8 A
Reference Standard AEC-Q200 AEC-Q200
Self Resonance Frequency 4000 MHz 4000 MHz
Shape/Size Description RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Shielded NO NO
Special Feature Q FACTOR IS MEASURED AT: 100MHZ Q FACTOR IS MEASURED AT: 100MHZ
Surface Mount YES YES
Terminal Finish TIN SILVER COPPER
Terminal Placement DUAL ENDED DUAL ENDED
Terminal Shape J BEND J BEND
Test Frequency 10 MHz 10 MHz
Tolerance 10% 10%
Base Number Matches 1 1

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