B82422A3829K108
vs
B82422A3829K150
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TDK CORP
TDK CORP
Package Description
CHIP
CHIP
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8504.50.80.00
8504.50.80.00
Case/Size Code
1210
1210
Construction
Rectangular
Rectangular
Core Material
Ceramic
Ceramic
DC Resistance
0.08 Ω
0.08 Ω
Inductance-Nom (L)
0.0082 µH
0.0082 µH
Inductor Application
RF INDUCTOR
RF INDUCTOR
Inductor Type
GENERAL PURPOSE INDUCTOR
GENERAL PURPOSE INDUCTOR
JESD-609 Code
e1
Number of Functions
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
2 mm
2 mm
Package Length
3.2 mm
3.2 mm
Package Style
SMT
SMT
Package Width
2.5 mm
2.5 mm
Packing Method
TR, Blister, 13 Inch
TR, Blister, 7 Inch
Quality Factor-Min (at L-nom)
20
20
Rated Current-Max
0.8 A
0.8 A
Reference Standard
AEC-Q200
AEC-Q200
Self Resonance Frequency
4000 MHz
4000 MHz
Shape/Size Description
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Shielded
NO
NO
Special Feature
Q FACTOR IS MEASURED AT: 100MHZ
Q FACTOR IS MEASURED AT: 100MHZ
Surface Mount
YES
YES
Terminal Finish
TIN SILVER COPPER
Terminal Placement
DUAL ENDED
DUAL ENDED
Terminal Shape
J BEND
J BEND
Test Frequency
10 MHz
10 MHz
Tolerance
10%
10%
Base Number Matches
1
1
Compare B82422A3829K108 with alternatives
Compare B82422A3829K150 with alternatives