AX500-FG484IX79 vs AX500-FG484MX79 feature comparison

AX500-FG484IX79 Microsemi Corporation

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AX500-FG484MX79 Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description BGA, BGA,
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 500000 SYSTEM GATES AVAILABLE 500000 SYSTEM GATES AVAILABLE
Clock Frequency-Max 649 MHz 649 MHz
Combinatorial Delay of a CLB-Max 0.99 ns 0.99 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e0
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 5376 5376
Number of Equivalent Gates 286000 286000
Number of Terminals 484 484
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 5376 CLBS, 286000 GATES 5376 CLBS, 286000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 23 mm
Base Number Matches 3 3
ECCN Code 3A001.A.2.C

Compare AX500-FG484IX79 with alternatives

Compare AX500-FG484MX79 with alternatives