AX500-FG484IX79 vs AX500-1FGG484M feature comparison

AX500-FG484IX79 Microsemi Corporation

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AX500-1FGG484M Microchip Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description BGA, 1 MM PITCH, ROHS COMPLIANT, FBGA-484
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 500000 SYSTEM GATES AVAILABLE 500000 SYSTEM GATES AVAILABLE
Clock Frequency-Max 649 MHz 763 MHz
Combinatorial Delay of a CLB-Max 0.99 ns 0.84 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e1
Length 23 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 5376 5376
Number of Equivalent Gates 286000 500000
Number of Terminals 484 484
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 5376 CLBS, 286000 GATES 5376 CLBS, 500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 27 mm
Base Number Matches 3 3
ECCN Code 3A001.A.2.C
Number of Inputs 336
Number of Logic Cells 8064
Number of Outputs 336
Package Equivalence Code BGA484,22X22,40
Peak Reflow Temperature (Cel) 250
Screening Level MIL-STD-883 Class B
Time@Peak Reflow Temperature-Max (s) 30

Compare AX500-FG484IX79 with alternatives

Compare AX500-1FGG484M with alternatives