AX250-FGG484 vs AX250-2FG484I feature comparison

AX250-FGG484 Microsemi Corporation

Buy Now Datasheet

AX250-2FG484I Microchip Technology Inc

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description BGA, BGA484,22X22,40 1 MM PITCH, FBGA-484
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 250000 SYSTEM GATES AVAILABLE 250000 SYSTEM GATES AVAILABLE
Clock Frequency-Max 649 MHz 870 MHz
Combinatorial Delay of a CLB-Max 0.99 ns 0.74 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2816 2816
Number of Equivalent Gates 250000 250000
Number of Inputs 248 248
Number of Logic Cells 4224 4224
Number of Outputs 248 248
Number of Terminals 484 484
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2816 CLBS, 250000 GATES 2816 CLBS, 250000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm 27 mm
Base Number Matches 3 3
Factory Lead Time 8 Weeks

Compare AX250-FGG484 with alternatives

Compare AX250-2FG484I with alternatives