AX250-FG484IX79 vs AX250-2FGG484I feature comparison

AX250-FG484IX79 Microsemi Corporation

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AX250-2FGG484I Microchip Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description BGA, 1 MM PITCH, ROHS COMPLIANT, FBGA-484
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 250000 SYSTEM GATES AVAILABLE 250000 SYSTEM GATES AVAILABLE
Clock Frequency-Max 649 MHz 870 MHz
Combinatorial Delay of a CLB-Max 0.99 ns 0.74 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e1
Length 23 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2816 2816
Number of Equivalent Gates 154000 250000
Number of Terminals 484 484
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2816 CLBS, 154000 GATES 2816 CLBS, 250000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 27 mm
Base Number Matches 3 3
Factory Lead Time 8 Weeks
Number of Inputs 248
Number of Logic Cells 4224
Number of Outputs 248
Package Equivalence Code BGA484,22X22,40
Packing Method TRAY
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30

Compare AX250-FG484IX79 with alternatives

Compare AX250-2FGG484I with alternatives