AX250-FG256M
vs
AX250-1FG256I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
LBGA, BGA256,16X16,40
1 MM PITCH, FBGA-256
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
250000 SYSTEM GATES AVAILABLE
250000 SYSTEM GATES AVAILABLE
Clock Frequency-Max
649 MHz
763 MHz
Combinatorial Delay of a CLB-Max
0.99 ns
0.84 ns
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
2816
2816
Number of Equivalent Gates
250000
250000
Number of Inputs
248
248
Number of Logic Cells
4224
4224
Number of Outputs
248
248
Number of Terminals
256
256
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
2816 CLBS, 250000 GATES
2816 CLBS, 250000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Seated Height-Max
1.7 mm
1.7 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
17 mm
Base Number Matches
2
2
Factory Lead Time
8 Weeks
Compare AX250-FG256M with alternatives
Compare AX250-1FG256I with alternatives