AX250-FG256M
vs
AX250-1FG256
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
LBGA, BGA256,16X16,40
|
1 MM PITCH, FBGA-256
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
250000 SYSTEM GATES AVAILABLE
|
250000 SYSTEM GATES AVAILABLE
|
Clock Frequency-Max |
649 MHz
|
763 MHz
|
Combinatorial Delay of a CLB-Max |
0.99 ns
|
0.84 ns
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
17 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
2816
|
2816
|
Number of Equivalent Gates |
250000
|
250000
|
Number of Inputs |
248
|
248
|
Number of Logic Cells |
4224
|
4224
|
Number of Outputs |
248
|
248
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
2816 CLBS, 250000 GATES
|
2816 CLBS, 250000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883 Class B
|
|
Seated Height-Max |
1.7 mm
|
1.7 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
2
|
6
|
Factory Lead Time |
|
8 Weeks
|
Packing Method |
|
TRAY
|
|
|
|
Compare AX250-FG256M with alternatives
Compare AX250-1FG256 with alternatives