AX250-3FGG484I
vs
AX250-1FG484M
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
BGA,
|
1 MM PITCH, FBGA-484
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
250000 SYSTEM GATES AVAILABLE
|
250000 SYSTEM GATES AVAILABLE
|
| JESD-30 Code |
S-PBGA-B484
|
S-PBGA-B484
|
| JESD-609 Code |
e1
|
e0
|
| Length |
23 mm
|
27 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Equivalent Gates |
154000
|
250000
|
| Number of Terminals |
484
|
484
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Organization |
154000 GATES
|
2816 CLBS, 250000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.44 mm
|
2.44 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
23 mm
|
27 mm
|
| Base Number Matches |
2
|
3
|
| ECCN Code |
|
3A001.A.2.C
|
| Clock Frequency-Max |
|
763 MHz
|
| Combinatorial Delay of a CLB-Max |
|
0.84 ns
|
| Number of CLBs |
|
2816
|
| Number of Inputs |
|
248
|
| Number of Logic Cells |
|
4224
|
| Number of Outputs |
|
248
|
| Package Equivalence Code |
|
BGA484,22X22,40
|
| Packing Method |
|
TRAY
|
| Screening Level |
|
MIL-STD-883 Class B
|
|
|
|
Compare AX250-3FGG484I with alternatives
Compare AX250-1FG484M with alternatives