AX250-2FG484I vs AX250-FGG484 feature comparison

AX250-2FG484I Microchip Technology Inc

Buy Now Datasheet

AX250-FGG484 Microsemi Corporation

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description 1 MM PITCH, FBGA-484 BGA, BGA484,22X22,40
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 8 Weeks
Additional Feature 250000 SYSTEM GATES AVAILABLE 250000 SYSTEM GATES AVAILABLE
Clock Frequency-Max 870 MHz 649 MHz
Combinatorial Delay of a CLB-Max 0.74 ns 0.99 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2816 2816
Number of Equivalent Gates 250000 250000
Number of Inputs 248 248
Number of Logic Cells 4224 4224
Number of Outputs 248 248
Number of Terminals 484 484
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 2816 CLBS, 250000 GATES 2816 CLBS, 250000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 3 3
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30

Compare AX250-2FG484I with alternatives

Compare AX250-FGG484 with alternatives