AX250-1FGG256M vs AX250-2FGG256I feature comparison

AX250-1FGG256M Microsemi Corporation

Buy Now Datasheet

AX250-2FGG256I Microsemi Corporation

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description LBGA, BGA256,16X16,40 LBGA, BGA256,16X16,40
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 250000 SYSTEM GATES AVAILABLE 250000 SYSTEM GATES AVAILABLE
Clock Frequency-Max 763 MHz 870 MHz
Combinatorial Delay of a CLB-Max 0.84 ns 0.74 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e1
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2816 2816
Number of Equivalent Gates 250000 250000
Number of Inputs 248 248
Number of Logic Cells 4224 4224
Number of Outputs 248 248
Number of Terminals 256 256
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 2816 CLBS, 250000 GATES 2816 CLBS, 250000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 250 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
Base Number Matches 3 3

Compare AX250-1FGG256M with alternatives

Compare AX250-2FGG256I with alternatives