AX250-1FGG256
vs
AX250-1FG256
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
ACTEL CORP
Package Description
LBGA, BGA256,16X16,40
1 MM PITCH, FBGA-256
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
Additional Feature
250000 SYSTEM GATES AVAILABLE
250000 SYSTEM GATES AVAILABLE
Clock Frequency-Max
763 MHz
763 MHz
Combinatorial Delay of a CLB-Max
0.84 ns
0.84 ns
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e0
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
2816
2816
Number of Equivalent Gates
250000
154000
Number of Inputs
248
248
Number of Logic Cells
4224
4224
Number of Outputs
248
248
Number of Terminals
256
256
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2816 CLBS, 250000 GATES
2816 CLBS, 154000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Peak Reflow Temperature (Cel)
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.8 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
17 mm
17 mm
Base Number Matches
3
3
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