AX1000-1FG676M
vs
AX1000-2FGG676
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
BGA, BGA676,26X26,40
1 MM PITCH, ROHS COMPLIANT, FBGA-676
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microsemi Corporation
Additional Feature
1000000 SYSTEM GATES AVAILABLE
1000000 SYSTEM GATES AVAILABLE
Clock Frequency-Max
763 MHz
870 MHz
Combinatorial Delay of a CLB-Max
0.84 ns
0.74 ns
JESD-30 Code
S-PBGA-B676
S-PBGA-B676
JESD-609 Code
e0
e1
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of CLBs
12096
12096
Number of Equivalent Gates
1000000
1000000
Number of Inputs
516
516
Number of Logic Cells
18144
18144
Number of Outputs
516
516
Number of Terminals
676
676
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
12096 CLBS, 1000000 GATES
12096 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA676,26X26,40
BGA676,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Seated Height-Max
2.44 mm
2.44 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
Base Number Matches
2
3
Factory Lead Time
12 Weeks
Packing Method
TRAY
Peak Reflow Temperature (Cel)
250
Time@Peak Reflow Temperature-Max (s)
30
Compare AX1000-1FG676M with alternatives
Compare AX1000-2FGG676 with alternatives