AVC16835DGG
vs
PI74AVC16835AE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
PERICOM SEMICONDUCTOR CORP
Package Description
TSSOP,
TSSOP, TSSOP56,.3,20
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
AVC
AVC
JESD-30 Code
R-PDSO-G56
R-PDSO-G56
Length
14 mm
14 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
18
18
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
56
56
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
4.5 ns
4.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
1.65 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
6.1 mm
6.1 mm
Base Number Matches
1
1
Rohs Code
Part Package Code
TSSOP
Pin Count
56
ECCN Code
EAR99
Control Type
ENABLE LOW
JESD-609 Code
e3
Load Capacitance (CL)
50 pF
Max I(ol)
0.012 A
Moisture Sensitivity Level
1
Package Equivalence Code
TSSOP56,.3,20
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
2.5 ns
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
40
Compare AVC16835DGG with alternatives
Compare PI74AVC16835AE with alternatives