AV16241DL-T
vs
74LCXZ16245MTD
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FAIRCHILD SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
TSSOP
|
| Package Description |
SSOP,
|
6.10 MM, MO-153ED, TSSOP-48
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
OUTPUT ENABLE ACTIVE HIGH FOR TWO FUNCTIONS; CAN ALSO OPERATE AT 3.3V VCC
|
|
| Family |
ALVT
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
| Length |
15.875 mm
|
12.5 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
BUS DRIVER
|
BUS TRANSCEIVER
|
| Number of Bits |
4
|
8
|
| Number of Functions |
4
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
48
|
48
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Power Supply Current-Max (ICC) |
4.5 mA
|
|
| Propagation Delay (tpd) |
2.7 ns
|
5.2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.8 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
6.1 mm
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Manufacturer Package Code |
|
48 LD,TSSOP,JEDEC MO-153, 6.1MM WIDE
|
| ECCN Code |
|
EAR99
|
| Control Type |
|
COMMON CONTROL
|
| Count Direction |
|
BIDIRECTIONAL
|
| JESD-609 Code |
|
e4
|
| Max I(ol) |
|
0.024 A
|
| Moisture Sensitivity Level |
|
2
|
| Package Equivalence Code |
|
TSSOP48,.3,20
|
| Packing Method |
|
RAIL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
4.5 ns
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare AV16241DL-T with alternatives
Compare 74LCXZ16245MTD with alternatives