AU1000266MCI vs TNETV1060GDW feature comparison

AU1000266MCI AMD

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TNETV1060GDW Texas Instruments

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description LBGA, BGA324,22X22,40 BGA,
Pin Count 324 324
Reach Compliance Code unknown not_compliant
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32 24
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 15 MHz 35 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B324 S-PBGA-B324
Length 23 mm 23 mm
Low Power Mode YES YES
Number of Terminals 324 324
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA324,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 2.49 mm
Speed 266 MHz 165 MHz
Supply Voltage-Max 1.6 V 1.575 V
Supply Voltage-Min 1.4 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 20
Width 23 mm 23 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 2 1
ECCN Code 3A991.A.2
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD

Compare AU1000266MCI with alternatives

Compare TNETV1060GDW with alternatives