ATT1765ASO8-TR vs XC1765EVOG8C feature comparison

ATT1765ASO8-TR LSI Corporation

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XC1765EVOG8C AMD Xilinx

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LUCENT TECHNOLOGIES INC XILINX INC
Package Description SOP, TSOP2,
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.51
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Memory Density 65536 bit 65536 bit
Memory IC Type OTP ROM CONFIGURATION MEMORY
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX1 64KX1
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP2
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.01 mA
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology MOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code Yes
Part Package Code TSOP
Pin Count 8
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-609 Code e3
Length 4.9276 mm
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.1938 mm
Terminal Finish MATTE TIN
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.937 mm

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Compare XC1765EVOG8C with alternatives