ATT1765AP8 vs XC1765EPD8I feature comparison

ATT1765AP8 LSI Corporation

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XC1765EPD8I Rochester Electronics LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer LUCENT TECHNOLOGIES INC ROCHESTER ELECTRONICS LLC
Package Description DIP, DIP8,.3 DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 35 ns
Clock Frequency-Max (fCLK) 10 MHz
I/O Type COMMON
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0 e0
Memory Density 65356 bit 65536 bit
Memory IC Type OTP ROM CONFIGURATION MEMORY
Memory Width 8 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 65536 words 65536 words
Number of Words Code 32 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 32X8 64KX1
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified COMMERCIAL
Standby Current-Max 0.0001 A
Supply Current-Max 0.11 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 2
Pbfree Code No
Part Package Code DIP
Pin Count 8
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Length 9.3599 mm
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 225
Seated Height-Max 4.5974 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm

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