ATSAMV71Q21B-AABT
vs
ATSAMV71Q21B-CB
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
| Package Description |
LFQFP,
|
TFBGA,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
2016-06-01
|
2016-06-01
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
ONE ADC CHANNEL IS RESERVED FOR INTERNAL TEMPERATURE SENSOR
|
ONE ADC CHANNEL IS RESERVED FOR INTERNAL TEMPERATURE SENSOR
|
| Address Bus Width |
24
|
24
|
| Bit Size |
32
|
32
|
| Clock Frequency-Max |
150 MHz
|
150 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-PQFP-G144
|
S-PBGA-B144
|
| Length |
20 mm
|
10 mm
|
| Number of I/O Lines |
114
|
114
|
| Number of Terminals |
144
|
144
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
TFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| RAM (bytes) |
393216
|
393216
|
| ROM (words) |
2097152
|
2097152
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
AEC-Q100; TS 16949
|
AEC-Q100; TS 16949
|
| Seated Height-Max |
1.6 mm
|
1.2 mm
|
| Speed |
300 MHz
|
300 MHz
|
| Supply Voltage-Max |
1.32 V
|
1.32 V
|
| Supply Voltage-Min |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
20 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
2
|
2
|
|
|
|