ATSAMR35J16BT-I/7JX
vs
ATSAMR35J17BT-I/7JX
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
TFBGA-64
|
TFBGA-64
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A992.C
|
5A992.C
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
6 Weeks
|
6 Weeks
|
Date Of Intro |
2018-11-09
|
2018-11-09
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
|
Bit Size |
32
|
32
|
Clock Frequency-Max |
48 MHz
|
48 MHz
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
|
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B64
|
S-PBGA-B64
|
Length |
6 mm
|
6 mm
|
Low Power Mode |
YES
|
YES
|
Number of DMA Channels |
16
|
16
|
Number of External Interrupts |
15
|
15
|
Number of I/O Lines |
27
|
27
|
Number of Terminals |
64
|
64
|
Number of Timers |
3
|
3
|
On Chip Data RAM Width |
32
|
32
|
On Chip Program ROM Width |
32
|
32
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA64,8X8,25
|
BGA64,8X8,25
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
RAM (bytes) |
8192
|
16384
|
RAM (words) |
2048
|
4096
|
ROM (words) |
16384
|
32768
|
ROM Programmability |
FLASH
|
FLASH
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
1.8 V
|
1.8 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
6 mm
|
6 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare ATSAMR35J16BT-I/7JX with alternatives
Compare ATSAMR35J17BT-I/7JX with alternatives