ATSAMD21J15B-CN
vs
ATSAMD21J15B-CZ
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
UFBGA-64
|
,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
2018-04-25
|
2020-02-03
|
| Has ADC |
YES
|
|
| Address Bus Width |
|
|
| Bit Size |
32
|
|
| Boundary Scan |
NO
|
|
| CPU Family |
Cortex-M0+
|
|
| Clock Frequency-Max |
32 MHz
|
|
| DAC Channels |
YES
|
|
| DMA Channels |
YES
|
|
| External Data Bus Width |
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B64
|
|
| Length |
5 mm
|
|
| Low Power Mode |
YES
|
|
| Number of DMA Channels |
12
|
|
| Number of External Interrupts |
16
|
|
| Number of I/O Lines |
52
|
|
| Number of Serial I/Os |
6
|
|
| Number of Terminals |
64
|
|
| Number of Timers |
8
|
|
| On Chip Data RAM Width |
8
|
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
105 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
VFBGA
|
|
| Package Equivalence Code |
BGA64,8X8,20
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
|
| RAM (bytes) |
4096
|
|
| ROM (words) |
32768
|
|
| ROM Programmability |
FLASH
|
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
0.65 mm
|
|
| Speed |
48 MHz
|
|
| Supply Current-Max |
92 mA
|
|
| Supply Voltage-Max |
3.63 V
|
|
| Supply Voltage-Min |
1.62 V
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
5 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare ATSAMD21J15B-CN with alternatives
Compare ATSAMD21J15B-CZ with alternatives