ATSAMD21E15C-UZT
vs
ATSAMD21E15L-MN
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
,
|
QFN-32
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Date Of Intro |
2020-02-03
|
2018-04-25
|
Base Number Matches |
1
|
2
|
ECCN Code |
|
3A991.A.2
|
Has ADC |
|
YES
|
Address Bus Width |
|
|
Bit Size |
|
32
|
Boundary Scan |
|
NO
|
CPU Family |
|
Cortex-M0+
|
Clock Frequency-Max |
|
32 MHz
|
DAC Channels |
|
YES
|
DMA Channels |
|
YES
|
External Data Bus Width |
|
|
Format |
|
FIXED POINT
|
Integrated Cache |
|
YES
|
JESD-30 Code |
|
S-XQCC-N32
|
Length |
|
5 mm
|
Low Power Mode |
|
YES
|
Number of DMA Channels |
|
12
|
Number of External Interrupts |
|
16
|
Number of I/O Lines |
|
26
|
Number of Serial I/Os |
|
4
|
Number of Terminals |
|
32
|
Number of Timers |
|
8
|
On Chip Data RAM Width |
|
8
|
On Chip Program ROM Width |
|
8
|
Operating Temperature-Max |
|
105 °C
|
Operating Temperature-Min |
|
-40 °C
|
PWM Channels |
|
YES
|
Package Body Material |
|
UNSPECIFIED
|
Package Code |
|
HVQCCN
|
Package Equivalence Code |
|
LCC32,.2SQ,20
|
Package Shape |
|
SQUARE
|
Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
RAM (bytes) |
|
4096
|
ROM (words) |
|
32768
|
ROM Programmability |
|
FLASH
|
Screening Level |
|
TS 16949
|
Seated Height-Max |
|
1 mm
|
Speed |
|
48 MHz
|
Supply Current-Max |
|
92 mA
|
Supply Voltage-Max |
|
3.63 V
|
Supply Voltage-Min |
|
1.62 V
|
Supply Voltage-Nom |
|
3.3 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
NO LEAD
|
Terminal Pitch |
|
0.5 mm
|
Terminal Position |
|
QUAD
|
Width |
|
5 mm
|
uPs/uCs/Peripheral ICs Type |
|
MICROCONTROLLER, RISC
|
|
|
|
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Compare ATSAMD21E15L-MN with alternatives