ATSAMD21E15C-UU
vs
ATSAMD21E15A-AU
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ATMEL CORP
|
| Package Description |
WLCSP-35
|
TQFP, TQFP32,.35SQ,32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
2018-04-25
|
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
|
| CPU Family |
Cortex-M0+
|
CORTEX-M0
|
| Clock Frequency-Max |
32 MHz
|
32 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
R-PBGA-B35
|
S-PQFP-G32
|
| Length |
2.78 mm
|
7 mm
|
| Low Power Mode |
YES
|
|
| Number of DMA Channels |
12
|
|
| Number of External Interrupts |
16
|
|
| Number of I/O Lines |
26
|
26
|
| Number of Serial I/Os |
4
|
|
| Number of Terminals |
35
|
32
|
| Number of Timers |
8
|
|
| On Chip Data RAM Width |
8
|
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
TQFP
|
| Package Equivalence Code |
BGA35,6X6,16
|
TQFP32,.35SQ,32
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
FLATPACK, THIN PROFILE
|
| RAM (bytes) |
4096
|
4096
|
| ROM (words) |
32768
|
32768
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
0.483 mm
|
1.2 mm
|
| Speed |
48 MHz
|
48 MHz
|
| Supply Current-Max |
92 mA
|
7 mA
|
| Supply Voltage-Max |
3.63 V
|
3.63 V
|
| Supply Voltage-Min |
1.62 V
|
1.62 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.4 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
2.578 mm
|
7 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Samacsys Manufacturer |
|
Microchip
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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